During the fast placement process in the Surface-Mount Technology (SMT), an adhesive with high green strength is used to avoid the displacement of components until they are soldered. Heraeus offers a SMT adhesive with excellent properties during the process as well as after soldering.

SMT adhesives are used in surface-mount assemblies on PCB to fix components to the board during wave soldering or double sided reflow. The adhesive is used to bond the Surface-Mount Device (SMD) to the PCB, in order to avoid displacement of components during high speed processes. The wet adhesive must provide sufficient “green” strength to hold the SMD in place during the complete soldering process. As well, the adhesive must not affect the function of the electronics circuit.

SMT adhesives are also used for BGA corner bonding to increase mechanical strength and reliability to BGAs and similar Chip-Scale Packages (CSPs): the material provides additional shock and bending resistance to the assembly.

Heraeus SMT adhesives are one-component thermo-setting solvent-free adhesives. They guarantee excellent adhesion with standard as well as with difficult-to-glue components. Best dispensing properties lead to maximum through-put and low cost of ownership. They are suitable for all common application methods such as printing, dispensing, pin transfer and jetting.