Ribbon bonding is the most common interconnect method for microwave and RF MCMs. Ribbons of both precious and nonprecious metals exhibit good heat dissipation and low apparent resistance (impedance). Ribbon bonding takes advantage of the “skin effect” of high-frequency signals, which causes almost all of the flow to be on the surface. Heraeus produces fine ribbons of gold, silver, platinum, and copper, as well as other metals on request. Gold bonding ribbon is especially suited for high-reliability applications such as microwave devices and in popular high-frequency applications. Our ribbons are typically custom-manufactured to exacting specifications. The resulting unrivalled uniformity of width minimizes snagging in bonding wedges. Many of our ribbons can also be plated with other metals. Controlled high purity and defined additives are essential for producing ribbons with precise dimensions and the required mechanical characteristics and looping behavior. For best results, precursor metals with a high purity of 99.999% are doped with other substances. Heraeus Fine Bonding Ribbons have a homogeneous chemical composition, stable mechanical properties and clean, smooth surfaces. These products can help you meet the challenges of thermal management, miniaturization and weight reduction.

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Heavy aluminum bonding wires and aluminum bonding ribbons are used for a wide variety of purposes. Since aluminum has twice the current-carrying capacity of copper per unit of weight, they are essential whenever power (i.e. not only signals) needs to be transmitted. We are unique in that we have specialized in aluminum as part of our core business, while also offering solder and sinter pastes, substrate materials, and other power electronics products. Heraeus supplies a full range of superb, high-purity products ranging from heavy wire for low currents all the way to ribbons with large cross-sections for high power transmission. All of them boast high reliability, excellent performance, and outstanding workability for a wide range of processing approaches and applications. Equally important is the fact that we supply these products in forms that simplify and streamline your own processes by enabling lean, cost-effective production with standardized methods. They are easy to handle and highly suitable for fully automated production.

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Copper as an interconnect material provides excellent electrical conductivity and fusing current values. That enables the use of thinner wires compared to aluminum wire connecting, resulting in better heat dissipation. In addition, copper is a mechanically stable metal, resulting in stronger wire connections and high loop stability. Heraeus offers three main types of heavy copper bonding wire: PowerCu, PowerCu Soft, and CucorAl (aluminum-cladded copper wire). All of them exhibit outstanding long-term reliability and result in highly robust bonds able to resist high temperatures and mechanical stresses. They are ideal for helping you solve the challenges posed by thermal management, the need for high robustness, miniaturization and weight reduction, as well as increased reliability. This includes power management in high-voltage modules and systems, even at high energy densities and temperatures. We are unique in focusing on thick bonding wires as part of our core business, while in parallel offering solder and sinter pastes, substrate materials, and other power electronics products. We supply these products in forms that simplify and streamline your own processes by enabling lean, cost-effective production with standardized methods.

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Electronic devices need to perform more in a smaller space with every new generation. Due to this trend, components become smaller and smaller, structures finer and finer. At the same time, the cost pressure leads to the development of cost-effective solutions, such as copper, and the demand for higher reliability raises. Heraeus copper bonding wires are in many cases a good alternative to expensive gold based solutions. With their ultra-fine diameters (0.6 mils or 15 um) they are suitable for very small structures with ultra-fine pitch. By adding alloy elements to the bare Cu wire or using CuPd / AFPC core cu wire, our bonding wires show advanced reliability and very good bondability. In many applications copper wire bonding can even provide better performance and reliability than gold wire bonding. Copper bonding wires are excellent for bonding in a ball / wedge process when using a reduced protective gas atmosphere. Processing is also possible in a wedge / wedge bonding process. For the selection of the ideal solution, Heraeus specialists with years of experience support you with their technical expertise and application know-how. On-site, they help you with the evaluation and qualification, especially on complex issues and configurations. Tests in our application and technology center enable us to test your adaptations directly in the application. Save time and money with Heraeus as a qualified partner and accelerate your developing process.

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The small-diameter aluminum wedge bonding wire available from Heraeus is made of high-quality AlSi1 alloy (99% aluminum and 1% silicon) and goes by the brand name of AlW-29S. Its principal applications are in motor vehicles, consumer electronics, and computers. In contrast to heavy aluminum wire, which is used to carry power, fine aluminum bonding wire is dedicated for signal transmission and processing. It is commonly used for Chip-On-Board (COB) applications. AlW-29S aluminum-alloy wire include compatibility with the aluminum on IC bonding pads, especially in fine-pitch applications. It can be easily and cost-effectively bonded at room temperature and is thus ideal for forming high-integrity bonds and preventing damage to sensitive devices. The electrical and thermal conductivity properties of ALW-29S are also excellent for a wide range of uses. Compared to other suppliers, aluminum bonding wires belong to our strategic core business. We are capable to match it to our comprehensive assembly material program and therefore reach better reliability, performance, and workability. This helps you to speed up your development and optimization processes, and bring your products to market faster.

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Finer structures and harsher conditions drive the development of the well-established gold bonding wires. For modern applications you need a wide variety of possibilities, depending on the exact requirements of your application. Heraeus offers a wide selection of ball, wedge and stud bonding wires in a varied portfolio of 4N 99.99 / 3N 99.9 / 2N 99.0 gold bonding wires types. All wires can be adapted exactly to your needs. For the selection of the ideal solution, our specialists with years of experience support you with their technical expertise and application know-how. On-site, they help you on the evaluation and qualification, especially on complex issues and configurations. Tests in our application and technology center enable us to test your adaptations directly in the application. Save time and money with Heraeus as a qualified partner and accelerate your developing process. Furthermore our expert team innovates new solutions to cover the demands of the future.

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