Cree’s Direct AttachTM SA1000TM LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary device technology to deliver superior value for the general illumination and automotive exterior markets. The SA1000 LEDs are among the brightest in the market at a low forward voltage, resulting in a very bright and highly efficient solution. The bondpad-down design allows for eutectic die attach, eliminating the need for wire bonds, enabling superior performance, improved thermal management and high reliabilty. The design is optimally suited for industry-standard top-view packages.

Go to see more：https://www.cree.com/led-chips/products/da-leds/sa1000

Cree’s MB Generation II series of MegaBright(R) LEDs combine highly efficient InGaN materials with Cree’s proprietary GoSiC(R) substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a geometrically enhanced vertical chip structure to maximize light extraction efficiency and require only a single wire bond connection. Sorted die kits provide die sheets conveniently sorted into wavelength and radiant flux bins. Cree’s MB series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000V ESD. These LEDs are useful in a broad range of applications such as outdoor full-motion LED video signs, automotive lighting and white LEDs, yet can also be used in high-volume applications such as LCD backlighting. Cree’s MB series chips are compatible with most radial and SMT LED assembly processes.

Go to see more：https://www.cree.com/led-chips/products/mb-leds/mb290