With the pursuit of building cheaper, faster and simpler assembly processes, the Surface-Mount Technology (SMT) replaces more and more the through-hole technology. Heraeus offers a complete portfolio for high reliability solder pastes for SMT applications on Printed Circuit Boards (PCB) and ceramics (e.g. DCB). We match the solder paste to your needs and give you the flexibility to build your optimal solution.

SMT has largely replaced the former through-hole technology for the assembly of electronic circuits on PCBs and ceramics. Since SMT components have either smaller or no leads, they are usually smaller than through-hole components. This leads to a much higher component and weight reduction.

For the setup of an optimal and cost effective production process, it is necessary to find the optimal combination of powder and flux of the solder paste depending on application and substrate. A comprehensive portfolio helps to match the configuration of the solder paste to the requirements of the process. Heraeus produces powder, flux and paste in four different locations. Our decentral solder powder production process guarantees highest yields, consistency and reliability.