With Heraeus bond preforms you achieve more reliable and flexible circuit board designs. Usually soldered onto PCBs and ceramic hybrids, the bond pads allow to apply additional and reliable bond isles fully automated.
The bondpads are characterized by an excellent electrical and thermal conductivity and enable complex functionalities and freedom of design in the tiniest space. With these advantages, they are mainly used in the automotive and high-end segment where miniaturisation and growing requirements play an ever-increasing role.
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