With Heraeus bond preforms you achieve more reliable and flexible circuit board designs. Usually soldered onto PCBs and ceramic hybrids, the bond pads allow to apply additional and reliable bond isles fully automated.

The bondpads are characterized by an excellent electrical and thermal conductivity and enable complex functionalities and freedom of design in the tiniest space. With these advantages, they are mainly used in the automotive and high-end segment where miniaturisation and growing requirements play an ever-increasing role.

Profit from our customer-specific advice. Together we will find the optimal configuration and material combination for your application.

Our solderable and adhesive bond preforms offer a particularly high level of conductivity with optimal use of space.

All benefits at a glance:

Excellent electrical and thermal conductivity
Highest robustness of the bonding connection
Bondable with Al thick wire, AlSi thin wire or gold wire
Optimal compatability with all solderable and adhesive surfaces
Easy and reliable processing by pick-and-place
Highest quality thanks to fully automated manufacturing equipment and 100% camera inspection
Freedom of design even within the smallest space
Compliance with legal regulations: All bond pads are available in RoHS compliant versions and may be used with both lead-containing and
lead-free solders.

Our service for you:

Together we can develop the best possible solution for your application.
We offer you a broad set of standard dimensions and material combinations. However, we also adapt both perfectly to your customer specific requirements.
Our experts advise you individually, always bearing your requirements in mind.
In our Technology Center we use different methods to carry out extensive material tests for you.

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Heraeus bonding pads are used to connect bond elements on PCBs and ceramic hybrids. The mono-metal connection with Al wires has been proven worldwide in millions of cars and high-end applications.
Electronic circuits for LEDs
Position sensors
Power modules
Connecting elements on circuit boards

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Base metal: CuSn6
Bonding side: AlSi1, Ag, Cu
Solder connection / adhesive side: Sn, Ag, …
Wire bondable with: Al, Au, Ag, Cu
We process further material combinations for you upon request.


We mass produce the following standard dimensions (very good availability):
0.2 x 1.8 x 1.8 mm
0.5 x 1.8 x 1.8 mm
0.6 x 0.8 x 1.6 mm
0.8 x 1.8 x 1.8 mm
0.8 x 1.8 x 4.2 mm
0.8 x 2.0 x 2.0 mm
0.8 x 2.8 x 2.8 mm
Contact us for other, customized dimensions.

Packaging Information:

Tape and reel packing according to DIN EN 60286-3 and EIA standard
Other options possible

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Obaju template

Request information about Heraeus welding materials products

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