Main product features: ESD protection of high-speed data line IEC 61000-4-2 electrostatic discharge contact discharge, typical 8Kv, maximum 15kvesd air discharge, typical 15kV, maximum 25kV surface mount, extremely low capacitance, extremely low leakage current, fast response time, bidirectional ESD protection..

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Main product features: forward voltage reduction, excellent high temperature stability, fast switching capability, suffix "g" for halogen-free components, such as csp545sg-a. Lead free parts conform to environmental standard mil-std-19500 / 228.

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Main product features: low profile surface mounting applications to optimize board space. Low power consumption, high efficiency. High current capability, low forward voltage drop. Ultra high speed switch. Silicon epitaxial plane chip, metal silicon junction. Lead free parts conform to environmental standard mil-std-19500 / 228

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Main product features: forward voltage reduction, excellent high temperature stability, fast switching ability, lead-free in line with EU ROHS.

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Main product features: low conduction and switching loss, positive temperature coefficient on VF, temperature independent switching behavior, fast reverse recovery, high surge current capability, lead-free electroplating.

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Main product features: p-on-n unidirectional Zener (6mil / 9MIL) (BVR = 7V ~ 10V, BVR = 11V ~ 15V, BVR = 23v ~ 40V, BVR = 45V ~ 65V) n open P unidirectional Zener (6mil / 9MIL) (BVR = 7V ~ 10V) NPN bidirectional Zener (6mil / 9MIL) BVR (positive direction) = 5V ~ 7V.

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