Automation is crucial for the production process of electronic boards. Heraeus Passive Component Pastes offer sufficient green strength for plate transfer with machine dipping. No matter if you need screen print, dip or spray application; Heraeus Passive Component Pastes will be the right choice.

Passive Component Pastes are thick film metallization products for passive components, including silver and silver-palladium based termination materials and inner electrodes pastes.

The challenge of each component paste is to be formulated to give sufficient green strength for plate transfer with machine dipping. Different rheologies for various application forms are necessary: screen print, dip or spray application. In Addition, the products have to be conform to the Restriction of Hazardous Substances EU directive (RoHs compliant).

Heraeus offers a complete line of RoHS compliant termination materials for the passive component industry. This line includes solderable and plateable terminations. These products have no lead and no cadmium.


Ferrites and Inductors
Chip Fuses
NTC and PTC Thermistors
Chip Resistors
Chip Arrays

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Typical products:

Plateable Ag terminations: ET1890A
Solderable Ag based terminations:
Low ohmic resistor series: R400AR

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